Nfion Thermal will introduce the production process of thermal silicon pad in detail, including the steps of raw material preparation, mixing, molding, vulcanization, cutting and inspection and other steps.
Thermal conductivity silicon pad is a high-performance heat-conducting material, which is widely used in various electronic devices to solve the internal heat transmission problem of the equipment.
Since the thermal conductive silicon pad is often used in the heat source and heat dissipation components of electronic products, it is relatively precise, so there should be a lot of attention when using this product in order to better play its role. Especially for the operators, the following matters need to be paid attention to during installation and use. Only in this way can the quality and performance stability of thermal conductive silicon pad be guaranteed.
CN >